Invention Application
US20140070393A1 HORIZONTALLY AND VERTICALLY ALIGNED GRAPHITE NANOFIBERS THERMAL INTERFACE MATERIAL FOR USE IN CHIP STACKS
有权
水平和垂直对准的石墨纳米纤维片用于芯片堆叠的热界面材料
- Patent Title: HORIZONTALLY AND VERTICALLY ALIGNED GRAPHITE NANOFIBERS THERMAL INTERFACE MATERIAL FOR USE IN CHIP STACKS
- Patent Title (中): 水平和垂直对准的石墨纳米纤维片用于芯片堆叠的热界面材料
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Application No.: US13613564Application Date: 2012-09-13
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Publication No.: US20140070393A1Publication Date: 2014-03-13
- Inventor: Gerald K. Bartley , Charles L. Johnson , John E. Kelly, III , Joseph Kuczynski , David R. Motschman , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
- Applicant: Gerald K. Bartley , Charles L. Johnson , John E. Kelly, III , Joseph Kuczynski , David R. Motschman , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L21/02 ; H01L23/00
Abstract:
The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip
Public/Granted literature
- US09111899B2 Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks Public/Granted day:2015-08-18
Information query
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