发明申请
US20140053980A1 SYSTEM AND METHOD FOR OPERATING CHEMICAL MECHANICAL POLISHING PROCESS
审中-公开
操作化学机械抛光工艺的系统和方法
- 专利标题： SYSTEM AND METHOD FOR OPERATING CHEMICAL MECHANICAL POLISHING PROCESS
- 专利标题（中）： 操作化学机械抛光工艺的系统和方法
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申请号： US13591167申请日： 2012-08-21
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公开(公告)号： US20140053980A1公开(公告)日： 2014-02-27
- 发明人: Chih-I Peng , Hsiang-Pi Chang , Cary Chia-Chiung Lo , Teng-Chun Tsai , Kuo-Yin Lin , Chih-Yuan Yang
- 申请人： Chih-I Peng , Hsiang-Pi Chang , Cary Chia-Chiung Lo , Teng-Chun Tsai , Kuo-Yin Lin , Chih-Yuan Yang
- 申请人地址： TW Hsinchu City
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu City
- 主分类号： B01D53/26
- IPC分类号： B01D53/26 ; B44C1/22
摘要：
A chemical mechanical polishing (CMP) chamber is disclosed. The CMP chamber includes a chamber body, a door mounted on the chamber body and a chamber substructure being one selected from a group consisting of a moisture separator separating a moisture generated in the CMP chamber, a supplementary exhaust port, a transparent window mounted on the door, a sampling port mounted on the door, a sealing material including a metal frame, an o-ring for sealing the door and a combination thereof.
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