Invention Application
US20130334630A1 MEMORY CELLS, SEMICONDUCTOR DEVICE STRUCTURES, MEMORY SYSTEMS, AND METHODS OF FABRICATION
有权
存储器单元,半导体器件结构,存储器系统和制造方法
- Patent Title: MEMORY CELLS, SEMICONDUCTOR DEVICE STRUCTURES, MEMORY SYSTEMS, AND METHODS OF FABRICATION
- Patent Title (中): 存储器单元,半导体器件结构,存储器系统和制造方法
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Application No.: US13527173Application Date: 2012-06-19
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Publication No.: US20130334630A1Publication Date: 2013-12-19
- Inventor: Witold Kula , Gurtej S. Sandhu , Stephen J. Kramer
- Applicant: Witold Kula , Gurtej S. Sandhu , Stephen J. Kramer
- Applicant Address: US ID Boise
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: US ID Boise
- Main IPC: H01L29/82
- IPC: H01L29/82 ; H01L21/8246

Abstract:
Methods of forming magnetic memory cells are disclosed. Magnetic and non-magnetic materials are formed into a primal precursor structure in an initial stress state of essentially no strain, compressive strain, or tensile strain. A stress-compensating material, e.g., a non-sacrificial, conductive material, is formed to be disposed on the primal precursor structure to form a stress-compensated precursor structure in a net beneficial stress state. Thereafter, the stress-compensated precursor structure may be patterned to form a cell core of a memory cell. The net beneficial stress state of the stress-compensated precursor structure lends to formation of one or more magnetic regions, in the cell core, exhibiting a vertical magnetic orientation without deteriorating a magnetic strength of the one or more magnetic regions. Also disclosed are memory cells, memory cell structures, semiconductor device structures, and spin torque transfer magnetic random access memory (STT-MRAM) systems.
Public/Granted literature
- US08923038B2 Memory cells, semiconductor device structures, memory systems, and methods of fabrication Public/Granted day:2014-12-30
Information query
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