发明申请
- 专利标题： NON-CONTACT SUBSTRATE PROCESSING
- 专利标题（中）： 非接触式基板加工
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申请号： US13786189申请日： 2013-03-05
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公开(公告)号： US20130224962A1公开(公告)日： 2013-08-29
- 发明人: Blake KOELMEL , Nyi O. MYO
- 申请人： Blake KOELMEL , Nyi O. MYO
- 主分类号： H01L21/687
- IPC分类号： H01L21/687
摘要：
Embodiments of the present invention provide apparatus and methods for supporting, positioning or rotating a semiconductor substrate during processing. One embodiment of the present invention provides a method for processing a substrate comprising positioning the substrate on a substrate receiving surface of a susceptor, and rotating the susceptor and the substrate by delivering flow of fluid from one or more rotating ports.
公开/授权文献
- US10074555B2 Non-contact substrate processing 公开/授权日：2018-09-11
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