- 专利标题: Non-contact substrate processing
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申请号: US13786189申请日: 2013-03-05
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公开(公告)号: US10074555B2公开(公告)日: 2018-09-11
- 发明人: Blake Koelmel , Nyi O. Myo
- 申请人: Applied Materials, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: APPLIED MATERIALS, INC.
- 当前专利权人: APPLIED MATERIALS, INC.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Patterson + Sheridan LLP
- 主分类号: H01L21/687
- IPC分类号: H01L21/687 ; C23C16/458 ; C23C16/52 ; C23C16/54 ; H01J37/32 ; H01L21/683
摘要:
Embodiments of the present invention provide apparatus and methods for supporting, positioning or rotating a semiconductor substrate during processing. One embodiment of the present invention provides a method for processing a substrate comprising positioning the substrate on a substrate receiving surface of a susceptor, and rotating the susceptor and the substrate by delivering flow of fluid from one or more rotating ports.
公开/授权文献
- US20130224962A1 NON-CONTACT SUBSTRATE PROCESSING 公开/授权日:2013-08-29
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