Invention Application
- Patent Title: Package-in-Package Using Through-Hole Via Die on Saw Streets
- Patent Title (中): 通过在通道上通孔的封装封装在锯片上
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Application No.: US13845409Application Date: 2013-03-18
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Publication No.: US20130214385A1Publication Date: 2013-08-22
- Inventor: Byung Tai Do , Heap Hoe Kuan , Seng Guan Chow
- Applicant: STATS ChipPAC, Ltd.
- Applicant Address: SG Singapore
- Assignee: STATS CHIPPAC, LTD.
- Current Assignee: STATS CHIPPAC, LTD.
- Current Assignee Address: SG Singapore
- Main IPC: H01L23/538
- IPC: H01L23/538
Abstract:
A semiconductor device includes a first die having top, bottom, and peripheral surfaces. A bond pad is formed over the top surface. An organic material is connected to the first die and disposed around the peripheral surface. A via hole is formed in the organic material. A metal trace connects the via hole to the bond pad. A conductive material is deposited in the via hole. A redistribution layer (RDL) has an interconnection pad disposed over the top surface of the first die.
Public/Granted literature
- US09524938B2 Package-in-package using through-hole via die on saw streets Public/Granted day:2016-12-20
Information query
IPC分类:
