Invention Application
US20130210172A1 WAFER THINNING APPARATUS HAVING FEEDBACK CONTROL AND METHOD OF USING
审中-公开
具有反馈控制功能的减速装置和使用方法
- Patent Title: WAFER THINNING APPARATUS HAVING FEEDBACK CONTROL AND METHOD OF USING
- Patent Title (中): 具有反馈控制功能的减速装置和使用方法
-
Application No.: US13371046Application Date: 2012-02-10
-
Publication No.: US20130210172A1Publication Date: 2013-08-15
- Inventor: Yuan-Hsuan Chen , Kei-Wei CHEN , Ying-Lang WANG , Kuo-Hsiu WEI
- Applicant: Yuan-Hsuan Chen , Kei-Wei CHEN , Ying-Lang WANG , Kuo-Hsiu WEI
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L21/66
- IPC: H01L21/66 ; B24B49/00 ; H01L21/306
Abstract:
A wafer thinning apparatus includes a first metrology tool configured to measure an initial thickness of the wafer. The wafer thinning apparatus further includes a controller connected to the first metrology tool, and configured to determine a polishing time based on the initial thickness, a predetermined thickness and a material removal rate. The wafer thinning apparatus further includes a polishing tool connected to the controller configured to polish the wafer for a period of time equal to the polishing time. The wafer thinning apparatus includes a second metrology tool connected to the controller and the polishing tool, and configured to measure a polished thickness. The controller is configured to update the material removal rate based on the polished thickness, the predetermined thickness and the polishing time.
Information query
IPC分类:
