Invention Application
- Patent Title: Module and Method of Manufacturing a Module
- Patent Title (中): 模块和模块的制造方法
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Application No.: US13116285Application Date: 2011-05-26
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Publication No.: US20120299170A1Publication Date: 2012-11-29
- Inventor: Daniel Kehrer , Stefan Martens , Tze Yang Hin , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
- Applicant: Daniel Kehrer , Stefan Martens , Tze Yang Hin , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56
Abstract:
A module and a method for manufacturing a module are disclosed. An embodiment of a module comprises a first semiconductor device, a frame arranged on the first semiconductor device, the frame comprising a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.
Public/Granted literature
- US08749056B2 Module and method of manufacturing a module Public/Granted day:2014-06-10
Information query
IPC分类:
