Invention Application
US20120286849A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE SYSTEM 审中-公开
半导体器件和半导体封装系统

  • Patent Title: SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE SYSTEM
  • Patent Title (中): 半导体器件和半导体封装系统
  • Application No.: US13468466
    Application Date: 2012-05-10
  • Publication No.: US20120286849A1
    Publication Date: 2012-11-15
  • Inventor: Tae Yong LEESang Hoon SHIN
  • Applicant: Tae Yong LEESang Hoon SHIN
  • Applicant Address: KR Icheon-si
  • Assignee: SK hynix Inc.
  • Current Assignee: SK hynix Inc.
  • Current Assignee Address: KR Icheon-si
  • Priority: KR10-2011-0044633 20110512
  • Main IPC: H01H37/76
  • IPC: H01H37/76
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE SYSTEM
Abstract:
A semiconductor apparatus includes: a plurality of electrical fuses; a rupture unit configured to rupture an electrical fuse in response to rupture information applicable to the plurality of electrical fuses, when a rupture enable signal is activated; a scan unit configured to output information on whether an each of the plurality of electrical fuses are ruptured or not, as scan information, when a scan enable signal is activated; and a shift register unit configured to receive an input signal in synchronization with a clock signal and store the input signal as the rupture information, and configured to receive the scan information and output the scan information as an output signal in synchronization with the clock signal.
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