Invention Application
- Patent Title: Devices including composite thermal capacitors
- Patent Title (中): 器件包括复合热电容器
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Application No.: US13066998Application Date: 2011-04-29
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Publication No.: US20120273920A1Publication Date: 2012-11-01
- Inventor: Andrei G. Fedorov , Craig Green , Yogendra Joshi
- Applicant: Andrei G. Fedorov , Craig Green , Yogendra Joshi
- Applicant Address: US GA Atlanta
- Assignee: Georgia Tech Research Corporation
- Current Assignee: Georgia Tech Research Corporation
- Current Assignee Address: US GA Atlanta
- Main IPC: H01L29/02
- IPC: H01L29/02
Abstract:
Embodiments of the present disclosure include devices or systems that include a composite thermal capacitor disposed in thermal communication with a hot spot of the device, methods of dissipating thermal energy in a device or system, and the like.
Public/Granted literature
- US08378453B2 Devices including composite thermal capacitors Public/Granted day:2013-02-19
Information query
IPC分类:
