The heating and the cooling are conducted. In the heating, atoms of the first layer are rearranged, distortion is removed, and the stress is alleviated. In the cooling, since the first layer has a greater thermal expansion rate than the piezoelectric body, the shrinkage of the first layer caused by the cooling is greater than that of the piezoelectric body, and the thermal stress caused by the difference in thermal expansion is applied to the piezoelectric body. The thermal stress applied to the piezoelectric body serves as a force compressing the piezoelectric body. Therefore, a compressing force is applied to the interface contacting between the first layer and the piezoelectric body to suppress creation of cracks from the interface, and, even though the deformation amount of the piezoelectric body increases, a method for manufacturing an ink jet type recording head with excellent crack resistance may be obtained.