发明申请
- 专利标题: METHODS AND SYSTEM FOR ANALYSIS AND MANAGEMENT OF PARAMETRIC YIELD
- 专利标题(中): 参数化分析与管理方法与系统
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申请号: US13471789申请日: 2012-05-15
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公开(公告)号: US20120227019A1公开(公告)日: 2012-09-06
- 发明人: James A. Culp , Paul Chang , Dureseti Chidambarrao , Praveen Elakkumanan , Jason Hibbeler , Anda C. Mocuta
- 申请人: James A. Culp , Paul Chang , Dureseti Chidambarrao , Praveen Elakkumanan , Jason Hibbeler , Anda C. Mocuta
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: G06F17/50
- IPC分类号: G06F17/50
摘要:
Impact on parametric performance of physical design choices for transistors is scored for on-current and off-current of the transistors. The impact of the design parameters are incorporated into parameters that measure predicted shift in mean on-current and mean off-current and parameters that measure predicted increase in deviations in the distribution of on-current and the off-current. Statistics may be taken at a cell level, a block level, or a chip level to optimize a chip design in a design phase, or to predict changes in parametric yield during manufacturing or after a depressed parametric yield is observed. Further, parametric yield and current level may be predicted region by region and compared with observed thermal emission to pinpoint any anomaly region in a chip to facilitate detection and correction in any mistakes in chip design.
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