发明申请
- 专利标题： DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DEFINED PADS
- 专利标题（中）： 具有嵌入线和金属定义垫的衬底的器件封装
-
申请号： US12975934申请日： 2010-12-22
-
公开(公告)号： US20120161330A1公开(公告)日： 2012-06-28
- 发明人: Mark S. Hlad , Islam A. Salama , Mihir K. Roy , Tao Wu , Yueli Liu , Kyu Oh Lee
- 申请人： Mark S. Hlad , Islam A. Salama , Mihir K. Roy , Tao Wu , Yueli Liu , Kyu Oh Lee
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/50 ; H01L21/52
摘要：
Package substrates enabling reduced bump pitches and package assemblies thereof. Surface-level metal features are embedded in a surface-level dielectric layer with surface finish protruding from a top surface of the surface-level dielectric for assembly, without solder resist, to an IC chip having soldered connection points. Package substrates are fabricated to enable multiple levels of trace routing with each trace routing level capable of reduced minimum trace width and spacing.
公开/授权文献
信息查询
IPC分类:
