Invention Application
US20120097985A1 Light Emitting Diode (LED) Package And Method Of Fabrication
审中-公开
发光二极管（LED）封装和制造方法
- Patent Title: Light Emitting Diode (LED) Package And Method Of Fabrication
- Patent Title (中): 发光二极管（LED）封装和制造方法
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Application No.: US12909367Application Date: 2010-10-21
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Publication No.: US20120097985A1Publication Date: 2012-04-26
- Inventor: Wen-Huang Liu , Chung-Che Dan , Yuan-Hsiao Chang , Hung-Jen Kao , Chen-Fu Chu , Hao-Chun Cheng
- Applicant: Wen-Huang Liu , Chung-Che Dan , Yuan-Hsiao Chang , Hung-Jen Kao , Chen-Fu Chu , Hao-Chun Cheng
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/52
Abstract:
A light emitting diode (LED) package includes a substrate, a light emitting diode (LED) die mounted to the substrate, a frame on the substrate, a wire bonded to the light emitting diode (LED) die and to the substrate, and a transparent dome configured as a lens encapsulating the light emitting diode (LED) die. A method for fabricating a light emitting diode (LED) package includes the steps of: providing a substrate; forming a frame on the substrate; attaching a light emitting diode (LED) die to the substrate; wire bonding a wire to the light emitting diode (LED) die and to the substrate; and dispensing a transparent encapsulation material on the frame configured to form a transparent dome and lens for encapsulating the light emitting diode (LED) die.
Information query
IPC分类:
