发明申请
- 专利标题： ENCAPSULATED CIRCUIT DEVICE FOR SUBSTRATES HAVING AN ABSORPTION LAYER, AND METHOD FOR THE MANUFACTURE THEREOF
- 专利标题（中）： 具有吸收层的基板的封装电路装置及其制造方法
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申请号： US13263647申请日： 2010-02-26
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公开(公告)号： US20120092842A1公开(公告)日： 2012-04-19
- 发明人: Jochen Neumeister , Reinhard Rieger
- 申请人： Jochen Neumeister , Reinhard Rieger
- 优先权： DE102009002519. 20090421
- 国际申请： PCT/EP2010/052503 WO 20100226
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K3/30
摘要：
An encapsulated circuit device has a substrate, components configured on a substrate surface portion of a component side of the substrate, an encapsulation, at least one electrical contact having an outer portion projecting out of the encapsulation and an inner portion provided in the circuit device that is electrically connected to the substrate. The encapsulation includes a rigid outer encapsulation, which extends completely around the substrate, the components and the inner portion of the at least one electrical contact, as well as a compressible deformation absorption layer, which is provided between the components and the outer encapsulation and at least completely covers the substrate surface portion on which the components are configured.
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