Invention Application
US20120061858A1 Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die
有权
半导体器件和使用具有与半导体芯片相同宽度的分配针形成模具底部填充物的方法
- Patent Title: Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die
- Patent Title (中): 半导体器件和使用具有与半导体芯片相同宽度的分配针形成模具底部填充物的方法
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Application No.: US12882083Application Date: 2010-09-14
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Publication No.: US20120061858A1Publication Date: 2012-03-15
- Inventor: SooMoon Park , ByoungWook Jang , DongSoo Moon
- Applicant: SooMoon Park , ByoungWook Jang , DongSoo Moon
- Applicant Address: SG Singapore
- Assignee: STATS CHIPPAC, LTD.
- Current Assignee: STATS CHIPPAC, LTD.
- Current Assignee Address: SG Singapore
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H01L21/56
Abstract:
A semiconductor device has a semiconductor die mounted over a surface of a substrate. A mold underfill dispensing needle has a width substantially equal to a width of the semiconductor die. The dispensing needle is placed in fluid communication with a side of the semiconductor die. A mold underfill is deposited from an outlet of the dispensing needle evenly across a width of the semiconductor die into an area between the semiconductor die and substrate without motion of the dispensing needle. The dispensing needle has a shank and the outlet in a T-configuration. The dispensing needle can have a plurality of pole portions between a shank and the outlet. The dispensing needle has a plate between a shank and the outlet. The outlet has an upper edge with a length substantially equal to or greater than a length of a lower edge of the outlet.
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