SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Invention Application

US20110294271A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权

Title translation: 半导体器件及其制造方法

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Patent Title: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Patent Title (中): 半导体器件及其制造方法
Application No.: US13205950

Application Date: 2011-08-09
Publication No.: US20110294271A1

Publication Date: 2011-12-01
Inventor: Shinji MORI , Tsutomu Sato , Koji Matsuo
Applicant: Shinji MORI , Tsutomu Sato , Koji Matsuo
Assignee: Kabushiki Kaisha Toshiba
Current Assignee: Kabushiki Kaisha Toshiba
Priority: JP2007-088836 20070329
Main IPC: H01L21/8238
IPC: H01L21/8238

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Abstract:

A semiconductor device includes a first pMISFET region having an Si channel, a second pMISFET region having an Si channel and an nMISFET region having an Si channel. First SiGe layers which apply first compression strain to the Si channel are embedded and formed in the first pMISFET region to sandwich the Si channel thereof and second SiGe layers which apply second compression strain different from the first compression strain to the Si channel are embedded and formed in the second pMISFET region to sandwich the Si channel thereof.

Abstract(Chinese):

半导体器件包括具有Si沟道的第一pMISFET区，具有Si沟道的第二pMISFET区和具有Si沟道的nMISFET区。将第一压缩应变施加到Si沟道的第一SiGe层嵌入并形成在第一pMISFET区域中以夹持其Si沟道，并且将施加与第一压缩应变不同的第二压缩应变的第二SiGe层嵌入并形成在第二pMISFET区域夹持其Si通道。

Public/Granted literature

US08124472B2 Manufacturing method of a semiconductor device Public/Granted day:2012-02-28

Information query

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8238	........互补场效应晶体管，例如CMOS