Invention Application
- Patent Title: Selective Shrinkage of Contact Elements in a Semiconductor Device
- Patent Title (中): 半导体器件中接触元件的选择性收缩
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Application No.: US13102411Application Date: 2011-05-06
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Publication No.: US20110291292A1Publication Date: 2011-12-01
- Inventor: Kai Frohberg , Ralf Richter , Torsten Huisinga , Katrin Reiche
- Applicant: Kai Frohberg , Ralf Richter , Torsten Huisinga , Katrin Reiche
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Priority: DE102010029533.7 20100531
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/768

Abstract:
In sophisticated semiconductor devices, the contact elements connecting to active semiconductor regions having formed thereabove closely spaced gate electrode structures may be provided on the basis of a liner material so as to reduce the lateral width of the contact opening, while, on the other hand, non-critical contact elements may be formed on the basis of non-reduced lateral dimensions. To this end, at least a first portion of the critical contact element is formed and provided with a liner material prior to forming the non-critical contact element.
Public/Granted literature
- US08536050B2 Selective shrinkage of contact elements in a semiconductor device Public/Granted day:2013-09-17
Information query
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