Invention Application
US20110286179A1 MEMORY MODULE CONNECTOR HAVING MEMORY MODULE COOLING STRUCTURES
有权
具有存储模块冷却结构的存储模块连接器
- Patent Title: MEMORY MODULE CONNECTOR HAVING MEMORY MODULE COOLING STRUCTURES
- Patent Title (中): 具有存储模块冷却结构的存储模块连接器
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Application No.: US12786067Application Date: 2010-05-24
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Publication No.: US20110286179A1Publication Date: 2011-11-24
- Inventor: David R. Motschman , Mark E. Steinke , Aparna Vallury
- Applicant: David R. Motschman , Mark E. Steinke , Aparna Vallury
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Main IPC: G06F1/20
- IPC: G06F1/20

Abstract:
One embodiment of the present invention provides a computer memory system that includes at least one DIMM connector having a DIMM socket for releasably receiving a terminal edge of a DIMM. A metallic or otherwise highly heat-conductive base is secured to the DIMM connector. A pair of heat spreaders is secured to the base on opposing sides of the DIMM socket. Each heat spreader includes a DIMM-engagement portion spaced from the base. The heat spreaders are nondestructively moveable between an open position spaced apart for receiving the DIMM between the heat spreaders and a closed position for thermally engaging opposing faces of the DIMM. The heat spreaders provide a continuous thermally-conductive pathway between the DIMM-engagement portion and the base. Heatsink fins extend laterally from the base to provide cooling.
Public/Granted literature
- US08139355B2 Memory module connector having memory module cooling structures Public/Granted day:2012-03-20
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