发明申请
- 专利标题： FILLING MATERIAL AND FILLING METHOD USING THE SAME
- 专利标题（中）： 填充材料和填充方法
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申请号： US13084847申请日： 2011-04-12
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公开(公告)号： US20110262762A1公开(公告)日： 2011-10-27
- 发明人: Shigenobu Sekine , Yurina Sekine , Yoshiharu Kuwana
- 申请人： Shigenobu Sekine , Yurina Sekine , Yoshiharu Kuwana
- 申请人地址： JP Tokyo
- 专利权人： NAPRA CO., LTD.
- 当前专利权人： NAPRA CO., LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2010-098664 20100422
- 主分类号： B22F7/02
- IPC分类号： B22F7/02 ; B05D3/02 ; B05D3/12 ; B05D7/22
摘要：
A filling material includes a support base member and a metal layer, the metal layer including a first metal layer and a second metal layer and being disposed on one side of the support base member, the first metal layer being an aggregate of nano metal particles and having a film thickness enabling melting at a temperature lower than a melting point, the second metal layer being an aggregate of metal particles having a lower melting point than the first metal layer.
公开/授权文献
- US08377565B2 Filling material and filling method using the same 公开/授权日：2013-02-19
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