发明申请
- 专利标题: SUBSTRATE PROCESSING SYSTEM
- 专利标题(中): 基板加工系统
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申请号: US13129167申请日: 2009-11-11
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公开(公告)号: US20110240223A1公开(公告)日: 2011-10-06
- 发明人: Shinji Matsubayashi , Satoru Kawakami , Yasuhiro Tobe , Masaru Nishimura , Yasushi Yagi , Teruyuki Hayashi , Yuji Ono , Fumio Shimo
- 申请人: Shinji Matsubayashi , Satoru Kawakami , Yasuhiro Tobe , Masaru Nishimura , Yasushi Yagi , Teruyuki Hayashi , Yuji Ono , Fumio Shimo
- 申请人地址: JP Minato-ku, Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Minato-ku, Tokyo
- 优先权: JP2008-292698 20081114
- 国际申请: PCT/JP2009/069196 WO 20091111
- 主分类号: B08B13/00
- IPC分类号: B08B13/00 ; B05C13/00
摘要:
There is provided a substrate processing system having high maintainability by widening a gap between various processing apparatuses connected with side surfaces of transfer modules and capable of achieving sufficient productivity by avoiding deterioration in throughput. The substrate processing system for manufacturing an organic EL device by forming a multiple number of layers including, e.g., an organic layer on a substrate includes at least one transfer module configured to be evacuable and arranged along a straight transfer route. Within the transfer module, a multiple number of loading/unloading areas for loading/unloading the substrate with respect to a processing apparatus and at least one stocking area positioned between the loading/unloading areas are alternately arranged along the transfer route in series, and the processing apparatus is connected with a side surface of the transfer module at a position facing each of the loading/unloading areas.
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