Invention Application
US20110210435A1 MEMS DEVICES 有权
MEMS器件

MEMS DEVICES
Abstract:
A method of manufacturing a MEMS device comprises forming a MEMS device element 14. A sacrificial layer 20 is provided over the device element and a package cover layer 24 is provided over the sacrificial layer. A spacer layer 13 is formed over the sacrificial layer and is etched to define spacer portions adjacent an outer side wall of the sacrificial layer. These improve the hermetic sealing of the side walls of the cover layer 24.
Public/Granted literature
Information query
Patent Agency Ranking
0/0