发明申请
- 专利标题： STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDER BALL
- 专利标题（中）： 降低焊球最大电流密度的结构和方法
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申请号： US12640752申请日： 2009-12-17
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公开(公告)号： US20110147922A1公开(公告)日： 2011-06-23
- 发明人: Raschid J. BEZAMA , Timothy H. DAUBENSPECK , Gary LaFONTANT , Ian D. MELVILLE , Ekta MISRA , George J. SCOTT , Krystyna W. SEMKOW , Timothy D. SULLIVAN , Robin A. SUSKO , Thomas A. WASSICK , Xiaojin WEI , Steven L. WRIGHT
- 申请人： Raschid J. BEZAMA , Timothy H. DAUBENSPECK , Gary LaFONTANT , Ian D. MELVILLE , Ekta MISRA , George J. SCOTT , Krystyna W. SEMKOW , Timothy D. SULLIVAN , Robin A. SUSKO , Thomas A. WASSICK , Xiaojin WEI , Steven L. WRIGHT
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/3205
摘要：
Structures and methods to reduce maximum current density in a solder ball are disclosed. A method includes forming a contact pad in a last wiring level and forming a plurality of wires of the contact pad extending from side edges of the contact pad to respective ones of a plurality of vias. Each one of the plurality of wires has substantially the same electrical resistance.
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