发明申请
- 专利标题: METHOD FOR THE PRODUCTION OF MULTI-STEPPED SUBSTRATE
- 专利标题(中): 用于生产多级基板的方法
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申请号: US12999235申请日: 2009-06-15
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公开(公告)号: US20110089141A1公开(公告)日: 2011-04-21
- 发明人: Ai Tanaka , Atsushi Kira , Koh Fuwa
- 申请人: Ai Tanaka , Atsushi Kira , Koh Fuwa
- 申请人地址: JP Kanagawa
- 专利权人: ULVAC,INC.
- 当前专利权人: ULVAC,INC.
- 当前专利权人地址: JP Kanagawa
- 优先权: JP2008-158538 20080617
- 国际申请: PCT/JP2009/060883 WO 20090615
- 主分类号: C23F1/04
- IPC分类号: C23F1/04
摘要:
A multi-stepped substrate having a plurality of steps is produced by forming, on the principal surface of a substrate, a plurality of masks which are put on top of each other, which differ from each other in the materials used for forming them and which are likewise different, from each other, in the means for peeling off the same; and that the substrate is subjected, in order, to dry-etching operations through the plurality of masks each having a desired shape such that the substrate has a plurality of steps each of which reflects the shape of each corresponding mask.
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