发明申请
US20110020977A1 Mechanical patterning of thin film photovoltaic materials and structure 有权
薄膜光伏材料和结构的机械图案化

  • 专利标题: Mechanical patterning of thin film photovoltaic materials and structure
  • 专利标题(中): 薄膜光伏材料和结构的机械图案化
  • 申请号: US12577133
    申请日: 2009-10-09
  • 公开(公告)号: US20110020977A1
    公开(公告)日: 2011-01-27
  • 发明人: Robert D. Wieting
  • 申请人: Robert D. Wieting
  • 申请人地址: US CA San Jose
  • 专利权人: Stion Corporation
  • 当前专利权人: Stion Corporation
  • 当前专利权人地址: US CA San Jose
  • 主分类号: H01L31/032
  • IPC分类号: H01L31/032
Mechanical patterning of thin film photovoltaic materials and structure
摘要:
A method for forming one or more patterns for a thin film photovoltaic material. The method includes providing a substrate including a molybdenum layer and an overlying absorber comprising a copper bearing species and a window layer comprising a cadmium bearing species. The substrate is supported to expose a surface of the window layer. In a specific embodiment, the method includes using a scribe device. The scribe device includes a scribe having a tip. The scribe device is configured to pivot about one or more regions and configured to apply pressure to the tip, such that the tip is placed on a selected region of the window layer or the absorber layer. The method moves the scribe device relative to the substrate in a direction to form a pattern on at least the window layer or the absorber layer at a determined speed maintaining the molybdenum layer free from the pattern.
信息查询
0/0