知搜-全球专利检索

  1. Login
  2. Sign Up
Invention Application
US20100166945A1 Methods of calculating thicknesses of layers and methods of forming layers using the same 审中-公开
计算层厚度的方法和使用其形成层的方法

Methods of calculating thicknesses of layers and methods of forming layers using the same
Abstract:
A method of calculating a thickness of a layer may include forming the layer on a substrate in a chamber, measuring optical emission spectrum data from the chamber, and calculating the thickness of the layer from the optical emission spectrum data. A method of forming a layer may include depositing the layer on a substrate in a chamber, measuring optical emission spectrum data from the chamber, calculating a thickness of the layer using the optical emission spectrum data, and ending the depositing of the layer when the calculated thickness of the layer is within a target thickness range.
Abstract(Chinese):

计算层的厚度的方法可以包括在室中的基板上形成层，测量来自室的光发射光谱数据，以及根据光发射光谱数据计算层的厚度。 形成层的方法可以包括将层沉积在室中的衬底上，从腔室测量光发射光谱数据，使用光发射光谱数据计算层的厚度，并且当所计算的 该层的厚度在目标厚度范围内。

Information query
Global Dossier Espacenet
Patent Agency Ranking
0/0