发明申请
US20100164096A1 Structures and Methods for Improving Solder Bump Connections in Semiconductor Devices
有权
用于改善半导体器件中焊料凸点连接的结构和方法
- 专利标题： Structures and Methods for Improving Solder Bump Connections in Semiconductor Devices
- 专利标题（中）： 用于改善半导体器件中焊料凸点连接的结构和方法
-
申请号： US12344711申请日： 2008-12-29
-
公开(公告)号： US20100164096A1公开(公告)日： 2010-07-01
- 发明人: Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter , Timothy D. Sullivan
- 申请人： Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter , Timothy D. Sullivan
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/44
摘要：
Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The structure includes a via formed in a dielectric layer to expose a contact pad and a capture pad formed in the via and over the dielectric layer. The capture pad has openings over the dielectric layer to form segmented features. The solder bump is deposited on the capture pad and the openings over the dielectric layer.
公开/授权文献
信息查询
IPC分类:
