The present invention provides a substrate applicable in a chip LED package, the substrate having a conductive layer, an insulation layer and a heat-dissipation plate in this order, wherein the insulation layer comprises a liquid crystal polyester soluble in a solvent and a sheet comprising inorganic fibers and/or organic fibers. The substrate has a small linear expansion coefficient of the insulation layer in the surface direction and is extremely useful for production of a chip LED package while having a practical heat resistance.