发明申请
- 专利标题： EMBEDDED STRUCTURE AND METHOD FOR MAKING THE SAME
- 专利标题（中）： 嵌入式结构及其制作方法
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申请号： US12211816申请日： 2008-09-17
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公开(公告)号： US20100065324A1公开(公告)日： 2010-03-18
- 发明人: Yi-Chun Liu , Wei-Ming Cheng , Tsung-Yuan Chen , Shu-Sheng Chiang
- 申请人： Yi-Chun Liu , Wei-Ming Cheng , Tsung-Yuan Chen , Shu-Sheng Chiang
- 主分类号： H05K3/00
- IPC分类号： H05K3/00 ; H05K1/11
摘要：
An embedded structure of circuit board is provided. The embedded structure of the present invention includes a dielectric layer, a pad opening disposed in the dielectric layer, and a via disposed in the pad opening and in the dielectric layer, wherein the outer surface of the dielectric layer has a substantially even surface.
公开/授权文献
- US08191248B2 Method for making an embedded structure 公开/授权日：2012-06-05
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