发明申请
US20090281251A1 Exterior material for electronic device comprising thermoplastic elastomer-resin alloy
审中-公开
包含热塑性弹性体 - 树脂合金的电子器件外用材料
- 专利标题: Exterior material for electronic device comprising thermoplastic elastomer-resin alloy
- 专利标题(中): 包含热塑性弹性体 - 树脂合金的电子器件外用材料
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申请号: US12292398申请日: 2008-11-18
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公开(公告)号: US20090281251A1公开(公告)日: 2009-11-12
- 发明人: Ah Hyun Bae , Geun Ho Lee , Hye Ran Yoon
- 申请人: Ah Hyun Bae , Geun Ho Lee , Hye Ran Yoon
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2008-0042869 20080508
- 主分类号: C08G18/44
- IPC分类号: C08G18/44
摘要:
An exterior material for an electronic device housing electronic parts is disclosed, wherein the exterior material is made of a thermoplastic elastomer-resin alloy comprising 1 to 99% by weight of a thermoplastic elastomer and 1 to 99% by weight of a resin. Particularly, provided is a thermoplastic elastomer alloy resin composition is provided that is suitable for use as interior materials for electronic devices with softness, color variety, impact resistance, water resistance, durability, abrasion resistance and rigidity.
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