Invention Application
- Patent Title: POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS
- Patent Title (中): 积极的组合和绘图过程
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Application No.: US12370652Application Date: 2009-02-13
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Publication No.: US20090202943A1Publication Date: 2009-08-13
- Inventor: Youichi Ohsawa , Takeshi Kinsho , Masaki Ohashi , Seiichiro Tachibana , Takeru Watanabe , Jun Hatakeyama
- Applicant: Youichi Ohsawa , Takeshi Kinsho , Masaki Ohashi , Seiichiro Tachibana , Takeru Watanabe , Jun Hatakeyama
- Priority: JP2008-031322 20080213
- Main IPC: G03F7/00
- IPC: G03F7/00 ; C08F228/02 ; C08F24/00
Abstract:
A positive resist composition comprises a polymer comprising recurring units having a sulfonium salt incorporated therein as a base resin which becomes soluble in alkaline developer under the action of acid. The polymer generates a strong sulfonic acid upon exposure to high-energy radiation so as to facilitate effective scission of acid labile groups in the resist composition.
Public/Granted literature
- US08062828B2 Positive resist composition and patterning process Public/Granted day:2011-11-22
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