发明申请
US20080248603A1 Nitride-based semiconductor element and method of preparing nitride-based semiconductor
审中-公开
氮化物系半导体元件及其制备氮化物系半导体的方法
- 专利标题: Nitride-based semiconductor element and method of preparing nitride-based semiconductor
- 专利标题(中): 氮化物系半导体元件及其制备氮化物系半导体的方法
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申请号: US12155804申请日: 2008-06-10
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公开(公告)号: US20080248603A1公开(公告)日: 2008-10-09
- 发明人: Tatsuya Kunisato , Hiroki Ohbo , Nobuhiko Hayashi , Takashi Kano
- 申请人: Tatsuya Kunisato , Hiroki Ohbo , Nobuhiko Hayashi , Takashi Kano
- 申请人地址: JP Osaka
- 专利权人: SANYO ELECTRIC CO., LTD.
- 当前专利权人: SANYO ELECTRIC CO., LTD.
- 当前专利权人地址: JP Osaka
- 优先权: JPJP2000-304809 20001004; JPJP2000-392946 20001225
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A method of preparing a nitride semiconductor capable of forming a nitride-based semiconductor layer having a small number of dislocations as well as a small number of crystal defects resulting from desorption with excellent crystallinity on the upper surface of a substrate through a small number of growth steps is proposed. The method of preparing a nitride-based semiconductor comprises steps of forming a mask layer on the upper surface of a substrate to partially expose the upper surface of the substrate, forming a buffer layer on the exposed part of the upper surface of the substrate and the upper surface of the mask layer and thereafter growing a nitride-based semiconductor layer. Thus, the outermost growth surface of the nitride-based semiconductor layer laterally grown on the mask layer does not come into contact with the mask layer. Therefore, desorption hardly takes place from the outermost growth surface of the nitride-based semiconductor layer, whereby a nitride-based semiconductor layer having a small number of defects is formed. Further, the mask layer is directly formed on the substrate, whereby the number of growth steps for the nitride-based semiconductor layer is reduced.
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