A semiconductor light-emitting device includes: a printed-wiring board 3; a light-emitting diode element 2 mounted on the printed-wiring board 3; and a resin body for sealing the light-emitting diode element 2. The resin body is composed of a first resin body 7 arranged around the light-emitting diode element 2, and a second resin body 8 which seals the light-emitting diode 2 and the first resin body 7. An upper edge of the first resin body 7 disposed at a lower position of the junction is configured to be at least on or beyond an imaginary line that connects the junction and a lower edge of the second resin body.