Invention Application
US20080098786A1 RELEASING MECHANISM AND LEVELING APPARATUS 有权
释放机制和调节装置

  • Patent Title: RELEASING MECHANISM AND LEVELING APPARATUS
  • Patent Title (中): 释放机制和调节装置
  • Application No.: US11923848
    Application Date: 2007-10-25
  • Publication No.: US20080098786A1
    Publication Date: 2008-05-01
  • Inventor: Takashi Yoshioka
  • Applicant: Takashi Yoshioka
  • Applicant Address: JP Sagamihara-shi
  • Assignee: Aida Engineering, Ltd.
  • Current Assignee: Aida Engineering, Ltd.
  • Current Assignee Address: JP Sagamihara-shi
  • Priority: JP2006-293421 20061030; JP2006-293422 20061030; JP2007-167606 20070626
  • Main IPC: B21B39/02
  • IPC: B21B39/02
RELEASING MECHANISM AND LEVELING APPARATUS
Abstract:
A release mechanism for use in a leveling apparatus that performs a leveling process on a work object that has been wound in a coil configuration as a result of the work object being passed between a front side work roll in contact with the front side surface of the work object and a back side work roll that is in contact with the back side surface of the work, wherein the releasing mechanism switches between a work clamp state that allows performance of the leveling process and a release state that releases the work object from the clamp state by displacing a work roll support member that supports one of the work rolls relative to the another support member to change a distance between the work rolls by utilizing rotational movement of an electric motor.
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