A method of manufacturing a capacitor-embedded low temperature co-fired ceramic substrate, the method including: manufacturing a capacitor part by firing a deposition including at least one high dielectric ceramic sheet to form a capacitor part; providing a plurality of low temperature co-fired green sheets each having at least one of a conductive pattern and a conductive via hole thereon; forming a low temperature co-fired ceramic deposition by depositing the low temperature co-fired green sheets to embed the capacitor part in the low temperature co-fired ceramic deposition, the embedded capacitor part connected to the one of conductive pattern and conductive via hole of an adjacent one of the green sheets; and firing the low temperature co-fired ceramic deposition having the capacitor part embedded therein. The capacitor-embedded low temperature co-fired ceramic substrate may be beneficially employed in various types of capacitor part such as a deposited chip capacitor and a capacitor layer structure.