发明申请
- 专利标题: Semiconductor device and method of manufacturing semiconductor device
- 专利标题(中): 半导体装置及其制造方法
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申请号: US11812149申请日: 2007-06-15
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公开(公告)号: US20070290329A1公开(公告)日: 2007-12-20
- 发明人: Kei Murayama , Mitsutoshi Higashi , Naoyuki Koizumi , Yuichi Taguchi , Akinori Shiraishi , Masahiro Sunohara
- 申请人: Kei Murayama , Mitsutoshi Higashi , Naoyuki Koizumi , Yuichi Taguchi , Akinori Shiraishi , Masahiro Sunohara
- 专利权人: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 优先权: JPP.2006-168166 20060616
- 主分类号: H01L23/12
- IPC分类号: H01L23/12
摘要:
In a semiconductor device 100, a light emitting element 120 has been mounted on an upper plane of a semiconductor substrate 102. In an impurity diffusion region of the semiconductor substrate 102, a P conducting type of a layer 104, and an N layer 106 have been formed, while an N conducting type impurity is implanted to the P layer 104, and then the implanted impurity is diffused to constitute the N layer 106. A zener diode 108 made of a semiconductor device has been formed by the P layer 104 and the N layer 106.
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