发明申请
US20070267730A1 Wafer level semiconductor chip packages and methods of making the same
审中-公开
晶圆级半导体芯片封装及其制作方法
- 专利标题： Wafer level semiconductor chip packages and methods of making the same
- 专利标题（中）： 晶圆级半导体芯片封装及其制作方法
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申请号： US11435345申请日： 2006-05-16
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公开(公告)号： US20070267730A1公开(公告)日： 2007-11-22
- 发明人: Victor Liew , Giles Humpston , Belgacem Haba
- 申请人： Victor Liew , Giles Humpston , Belgacem Haba
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A wafer having a front surface and contacts exposed at the front surface is treated by forming electrically conductive risers projecting upwardly from the contacts as, for example, by electroless plating, and then applying a flowable material over the front surface of the device, around the risers, to form a dielectric layer with the risers exposed at a top surface of the dielectric layer facing away from the device. Traces extending over the top surface of the dielectric layer may be formed, and may be connected to at least some of the risers.
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