发明申请
- 专利标题： Compliant terminal mountings with vented spaces and methods
- 专利标题（中）： 具有通风空间和方法的符合标准的端子座
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申请号： US11318815申请日： 2005-12-27
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公开(公告)号： US20070145536A1公开(公告)日： 2007-06-28
- 发明人: Michael Nystrom , Belgacem Haba , Giles Humpston
- 申请人： Michael Nystrom , Belgacem Haba , Giles Humpston
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/00
摘要：
A compliant structure is provided on a semiconductor wafer. The compliant structure includes cavities. The compliant structure and the wafer seal the cavities during process steps used to form conductive elements on the compliant structure. After processing, vents are opened to connect the cavities to the exterior of the assembly. The vents may be formed by severing the wafer and compliant structure to form individual units, so that the severance planes intersect channels or other voids communicating with the cavities. Alternatively, the vents may be formed by forming holes in the compliant structure, or by opening bores extending through the wafer.
公开/授权文献
- US07453139B2 Compliant terminal mountings with vented spaces and methods 公开/授权日：2008-11-18
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