发明申请
- 专利标题: HIGH THROUGHPUT CONTINUOUS PULSED LASER DEPOSITION PROCESS AND APPARATUS
- 专利标题(中): 高强度连续脉冲激光沉积工艺和设备
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申请号: US11554428申请日: 2006-10-30
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公开(公告)号: US20070116860A1公开(公告)日: 2007-05-24
- 发明人: Venkat Selvamanickam , Yijie Li , Chan Park
- 申请人: Venkat Selvamanickam , Yijie Li , Chan Park
- 申请人地址: US NY Schenectady 12304
- 专利权人: SuperPower, Inc.
- 当前专利权人: SuperPower, Inc.
- 当前专利权人地址: US NY Schenectady 12304
- 主分类号: B05D5/12
- IPC分类号: B05D5/12
摘要:
The present invention relates to an apparatus and method for forming a high-temperature superconducting film on a long tape substrate at speeds suitable for large-scale production. The method includes a spooling system for use in a high-throughput, continuous pulsed laser deposition (PLD) process in which a superconducting layer, such as yttrium-barium-copper-oxide (YBCO), is deposited atop a buffered metal substrate tape that is translated through one or more deposition chambers via the action of a reel-to-reel spooling system and a conductive-radiant multi-zone substrate heater. It also optionally includes a multi-target manipulator apparatus and multiple laser beams in which multiple targets are impinged upon simultaneously.
公开/授权文献
- US07501145B2 High throughput continuous pulsed laser deposition process 公开/授权日:2009-03-10
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