In order to minimize a distance from a power supply line and/or a ground line of a semiconductor integrated circuit of a semiconductor device to electrodes of a printed board, at least either a power supply electrode or the ground line of the semiconductor integrated circuit is connected to a metal film through openings provided in a protective film over the power supply electrode. The metal film is exposed on a side of the semiconductor device, adjacent to a printed board on which the semiconductor device is mounted, or on a side thereof, opposite from the printed board, and the metal film is connected a power supply electrode and/or a ground electrode of the printed board through the exposed surface of the metal film. Alternatively, upper and lower metal films connected to each other, with a stress relief film interposed therebetween, may be disposed in place of the metal film, or a metal sheet may be disposed over the metal film. Further, in order to minimize the length of a heat radiation path of the semiconductor integrated circuit of the semiconductor device, the protective film is deposited on the semiconductor integrated circuit, and the metal film is exposed on the side of the semiconductor device, adjacent to the printed board on which the semiconductor device is mounted, or on the side thereof, opposite from the printed board, thereby effecting heat radiation. Alternatively, the upper and lower metal films connected to each other, with the stress relief film interposed therebetween, may be disposed in place of the metal film, or a metal sheet functioning as a heat sink is disposed over the metal film.