Invention Application
- Patent Title: Semiconductor die package and method for making the same
- Patent Title (中): 半导体管芯封装及其制造方法
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Application No.: US11471291Application Date: 2006-06-19
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Publication No.: US20070001278A1Publication Date: 2007-01-04
- Inventor: Oseob Jeon , Yoonhwa Choi , Boon Gooi , Maria Cristina Estacio , David Chong , Tan Keng , Shibaek Nam , Rajeev Joshi , Chung-Lin Wu , Venkat Iyer , Lay Lim , Byoung-Ok Lee
- Applicant: Oseob Jeon , Yoonhwa Choi , Boon Gooi , Maria Cristina Estacio , David Chong , Tan Keng , Shibaek Nam , Rajeev Joshi , Chung-Lin Wu , Venkat Iyer , Lay Lim , Byoung-Ok Lee
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
Public/Granted literature
- US07772681B2 Semiconductor die package and method for making the same Public/Granted day:2010-08-10
Information query
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