发明申请
US20060264538A1 FLAME RETARDANT ADHESIVE COMPOSITION, AND ADHESIVE SHEET, COVERLAY FILM AND FLEXIBLE COPPER-CLAD LAMINATE USING SAME
审中-公开
阻燃粘合剂组合物,粘合片,覆盖膜和使用相同的柔性铜箔层压板
- 专利标题: FLAME RETARDANT ADHESIVE COMPOSITION, AND ADHESIVE SHEET, COVERLAY FILM AND FLEXIBLE COPPER-CLAD LAMINATE USING SAME
- 专利标题(中): 阻燃粘合剂组合物,粘合片,覆盖膜和使用相同的柔性铜箔层压板
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申请号: US11419648申请日: 2006-05-22
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公开(公告)号: US20060264538A1公开(公告)日: 2006-11-23
- 发明人: Toru NAKANISHI , Kazunori Kondo , Shigehiro Hoshida , Tadashi Amano
- 申请人: Toru NAKANISHI , Kazunori Kondo , Shigehiro Hoshida , Tadashi Amano
- 申请人地址: JP Chiyoda-ku
- 专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址: JP Chiyoda-ku
- 优先权: JP2005-149911 20050523
- 主分类号: C08L63/00
- IPC分类号: C08L63/00 ; C08K5/51
摘要:
Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) an organophosphinate compound, (E) a curing accelerator, and (F) a nitrogen-containing organophosphate compound represented by a general formula (1) shown below: (wherein, R1 to R4 each represent a hydrogen atom or an alkyl group, and X represents a nitrogen-containing bivalent organic group) Also provided are an adhesive sheet having a layer comprising the above composition, and a protective layer for covering the layer comprising the composition; a coverlay film having an electrically insulating film, and a layer comprising the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer comprising the above composition provided on top of the film, and a copper foil provided on top of the layer comprising the composition. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties). The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate.
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