Invention Application
- Patent Title: Apparatus for controlling flow rate of gases used in semiconductor deivce by differential pressure
- Patent Title (中): 用于通过差压控制用于半导体制冷的气体流量的装置
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Application No.: US10562158Application Date: 2004-06-24
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Publication No.: US20060151113A1Publication Date: 2006-07-13
- Inventor: Kang-Ho Ahn
- Applicant: Kang-Ho Ahn
- Applicant Address: KR KYUNGKI-DO 467-866
- Assignee: HYUNDAI CALIBRATION & CERTIFICATION
- Current Assignee: HYUNDAI CALIBRATION & CERTIFICATION
- Current Assignee Address: KR KYUNGKI-DO 467-866
- Priority: KR10-2003-0042584 20030627
- International Application: PCT/KR04/01533 WO 20040624
- Main IPC: H01L21/306
- IPC: H01L21/306 ; F16K15/00 ; B05C11/00 ; C23C16/00

Abstract:
Provided is apparatus for controlling flow rate of gases used in semiconductor device by differential pressure by generating differential pressure in a fluid path. A differential pressure generation element generates pressure difference in the fluid path of gases used in semiconductor device fabrication, a pressure, sensor which is installed at a bypass of the fluid path detects the pressure difference, and a central processing unit (CPU) measures and controls a flow rate of the gases, thereby the present invention is capable of controlling the flow rate precisely and rapidly, and enhancing the degree of purity of the gases by the filtering function of the differential pressure generation element itself.
Public/Granted literature
- US07334602B2 Apparatus for controlling flow rate of gases used in semiconductor device by differential pressure Public/Granted day:2008-02-26
Information query
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