Invention Application
- Patent Title: Encapsulated device with heat isolating structure
- Patent Title (中): 具有隔热结构的封装装置
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Application No.: US10983621Application Date: 2004-11-09
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Publication No.: US20050285257A1Publication Date: 2005-12-29
- Inventor: Jeffrey Chen , Chung-Zen Lin , Wen-Fu Hsu
- Applicant: Jeffrey Chen , Chung-Zen Lin , Wen-Fu Hsu
- Priority: TW93118036 20040623
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L23/10 ; H01L23/36
Abstract:
The present invention provides an encapsulated device with heat isolating structure and a reflow soldering method thereof. The encapsulated device has a micro heat spreader with vapor chamber formed on the surface, and a cover covers the encapsulated device and wraps the micro heat spreader. A hermetical space is formed to isolate the high temperature when forming the solder balls and performing the SMT process, and prevent the micro heat spreader from being damaged. The present invention can provide an encapsulated device with heat isolating structure and a reflow soldering method thereof to protect the product in the reflow soldering process and improve the yield, and the cover can be reused to lower the cost.
Information query
IPC分类:
