发明申请
- 专利标题： Wafer processing method
- 专利标题（中）： 晶圆加工方法
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申请号： US11147245申请日： 2005-06-08
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公开(公告)号： US20050277270A1公开(公告)日： 2005-12-15
- 发明人: Toshiyuki Yoshikawa , Toshio Tsuchiya
- 申请人： Toshiyuki Yoshikawa , Toshio Tsuchiya
- 专利权人： Disco Corporation
- 当前专利权人： Disco Corporation
- 优先权： JP2004-174978 20040614
- 主分类号： B23K26/00
- IPC分类号： B23K26/00 ; B23K26/08 ; B23K26/16 ; B23K26/18 ; B23K101/40 ; H01L21/301 ; H01L21/78
摘要：
A wafer processing method for carrying out processing by applying a laser beam along streets formed on a wafer, comprising a step of applying a laser beam at an incident angle of a predetermined inclination angle to the normal line of a processing surface of the wafer while the wafer is processing-fed along a street from one end to the other end on the side of the laser beam application at an acute angle to the processing surface of the wafer.
公开/授权文献
- US07399682B2 Wafer processing method 公开/授权日：2008-07-15
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