Invention Application
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US10921961Application Date: 2004-08-20
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Publication No.: US20050258519A1Publication Date: 2005-11-24
- Inventor: Koya Kikuchi , Noriou Shimada , Keiyo Kusanagi , Akihiko Hatasawa , Yutaka Kagaya
- Applicant: Koya Kikuchi , Noriou Shimada , Keiyo Kusanagi , Akihiko Hatasawa , Yutaka Kagaya
- Priority: JP2004-149833 20040520
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L21/60 ; H01L23/16 ; H01L23/31 ; H01L23/495 ; H01L23/498 ; H01L23/52
Abstract:
A semiconductor device includes: an insulating tape having a device hole and a plurality of holes; a plurality of leads formed on one surface of the tape and extending at one end into the device hole and at the other end into the holes; a semiconductor chip having a plurality of electrodes on a main surface thereof, being connected with the leads extending into the device hole; an encapsulant formed of an insulating resin, the leads and a predetermined portion of the tape; bump electrodes provided on one surface of the leads; slits provided in the tape between the encapsulant and the bump electrodes and extending along a column of the bump electrodes; and a warp prevention reinforcement made of an insulating film and formed over the tape; wherein the semiconductor chip and the bump electrodes are connected to one and the same surface side of the leads.
Public/Granted literature
Information query
IPC分类:
