发明申请
- 专利标题： Semiconductor device and multilayer substrate therefor
- 专利标题（中）： 半导体装置及其多层基板
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申请号： US11085520申请日： 2005-03-22
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公开(公告)号： US20050230826A1公开(公告)日： 2005-10-20
- 发明人: Naotaka Tanaka , Kenya Kawano , Akira Nagai , Koji Tasaki , Masaaki Yasuda
- 申请人： Naotaka Tanaka , Kenya Kawano , Akira Nagai , Koji Tasaki , Masaaki Yasuda
- 优先权： JP2004-082704 20040322
- 主分类号： H01L23/29
- IPC分类号： H01L23/29 ; H01L21/00 ; H01L21/58 ; H01L21/60 ; H01L21/607 ; H01L21/98 ; H01L23/12 ; H01L23/31 ; H01L25/065 ; H01L29/40
摘要：
An object of the present invention is to manufacture a semiconductor device improved in the connection reliability between a bump electrode and a substrate electrode. Supposing that an elastic modulus of an adhesive material, which is used for the purpose of electrically connecting a metal bump and an interconnect pattern and sealing the circuit surface of LSI of an LSI chip, after thermosetting is Ea; an elastic modulus of an insulating material constituting the surface layer of a packaging substrate after thermosetting is Eb; and an elastic modulus of a core material, if the substrate is a multilayer substrate having a core layer, is Ec, the material system of the present invention satisfies the following rational expression at normal temperature or a thermal contact bonding temperature of the adhesive material: at least Ea
公开/授权文献
- US07692296B2 Semiconductor device and multilayer substrate therefor 公开/授权日：2010-04-06
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