A damper component for absorbing and dissipating vibration and/or noise resonating from a device is provided. The damper component includes a viscoelastic damper layer, and a continuous constraining layer intimately contacting and encasing the damper layer. The constraining layer has a greater stiffness and higher modulus of dynamic shearing elasticity than the damper layer. The constraining layer is a molded sheet molding compound that is substantially immiscible with the viscoelastomer to provide a discrete interface between the constraining layer and the damper layer.