Invention Application
- Patent Title: Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads
- Patent Title (中): 允许电气设备与配备接触垫的面电连接和机械连接的过程
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Application No.: US10485693Application Date: 2002-08-02
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Publication No.: US20050034303A1Publication Date: 2005-02-17
- Inventor: Beatrice Bonvalot
- Applicant: Beatrice Bonvalot
- Applicant Address: FR Montrouge F-92120
- Assignee: Schlumberger Systemes
- Current Assignee: Schlumberger Systemes
- Current Assignee Address: FR Montrouge F-92120
- Priority: FR01/10483 20010803
- International Application: PCT/IB02/03041 WO 20020802
- Main IPC: G06K19/077
- IPC: G06K19/077 ; H01L21/60 ; H01L25/065 ; H01L25/07 ; H01L25/18 ; H05K3/00 ; H05K1/16
Abstract:
A method of manufacturing an electrical device that is electrically and mechanically connectable to another electrical device, the electrical device having a face equipped with contact pads, wherein the method includes: a layer-application step in which an adhesive layer is applied on the face equipped with contact pads, the adhesive layer being composed of a substance with adhesive properties; an opening-creation step in which an opening is created through the adhesive layer at the level of a contact pad; an opening-filing step in which the opening is filled with a conductive material so that the opening is substantially filled with the conductive material so as to form a conductive path the volume of which is defined by the opening.
Public/Granted literature
Information query
