发明申请
US20050005846A1 High throughput continuous pulsed laser deposition process and apparatus
审中-公开
高通量连续脉冲激光沉积工艺和设备
- 专利标题: High throughput continuous pulsed laser deposition process and apparatus
- 专利标题(中): 高通量连续脉冲激光沉积工艺和设备
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申请号: US10602294申请日: 2003-06-23
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公开(公告)号: US20050005846A1公开(公告)日: 2005-01-13
- 发明人: Venkat Selvamanickam , Yijie Li , Chan Park
- 申请人: Venkat Selvamanickam , Yijie Li , Chan Park
- 主分类号: C23C14/08
- IPC分类号: C23C14/08 ; C23C14/28 ; C23C14/56 ; H01L39/24 ; C23C16/00
摘要:
The present invention relates to an apparatus and method for forming a high-temperature superconducting film on a long tape substrate at speeds suitable for large-scale production. The method includes a spooling system for use in a high-throughput, continuous pulsed laser deposition (PLD) process in which a superconducting layer, such as yttrium-barium-copper-oxide (YBCO), is deposited atop a buffered metal substrate tape that is translated through one or more deposition chambers via the action of a reel-to-reel spooling system and a conductive-radiant multi-zone substrate heater. It also optionally includes a multi-target manipulator apparatus and multiple laser beams in which multiple targets are impinged upon simultaneously.
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